Novellus Systems Process Technologies

        PECVD

    CVD Tungsten

       HDP CVD

           ECD

           PVD

          UVTP

    Photoresist Strip

           CMP

Welcome to Novellus System's Technical News portal. To learn more about these process technologies, and Novellus' solutions for 32 nm and beyond, please enter your contact information below and someone will respond to you shortly. Thank you!

Current Topics

- Residue-Free 3x/2x High Dose Implant Strip
- RC Scaling
- Thin Dielectric Barriers
- SEF for 32 nm fill
- CoolFill™ for 32 nm W-CVD
- 32 nm UV-Absorbing Dielectric Films
- HCM IONX™ Ta(N) barriers for 3x/2x Cu Memory
- HDP-CVD GapFill for sub-45 nm devices
- Dense ULK films for 32 nm integration
- Double-sided polishing technology for 22 nm
  lithography requirements
- PVD Copper Seed for sub-2x nm technology
- SOLA® UVTP for 32nm ULK film integration
- HDP-CVD Shallow Trench Isolation for 32 nm

- SABRE® Excel for 22 nm copper electrochemical deposition

- LRWxT for reduced contact and line resistance at 3X nm technology nodes

- Ashable hardmask PECVD films for sub-32 nm lithographic patterning
- SOLA xT UVTP for sub-45nm high volume manufacturing

 

 

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