The most recent variant of the highly-successful SABRE product line, the SABRE Extreme is targeted for the 45 nm and 32 nm technology nodes. SABRE Extreme features a revised plating cell that incorporates the latest membrane technology to improve on-wafer performance and reduce cost-of-consumables. The new system is designed to run the leading edge electrofill chemistry, Viaform Extreme, which is key to providing an advanced filling capability on the narrow, high aspect ratios found at 45 and 32 nm.
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SABRE Extreme
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